Table of contents
- Bonding Overview
 - Foreword
 - Introduction
 - Credits
 - A special thank you to the editing team
 - Additional Contributors
 - Section One Introduction to Joining
 - 1.1 Conventional Methods for Joining
 - 1.1.1 Mechanical Joint: Threaded Fasteners
 - 1.1.2 Mechanical Joint: Rivets
 - 1.1.3 Mechanical Joint: Keyway
 - 1.1.4 Mechanical Joint: Folding or Clinching
 - 1.1.5 Mechanical Joint: Press Fit
 - 1.1.6 Mechanical Joint: Shrink Fit
 - 1.1.7 Thermal Joint: Welding
 - 1.1.8 Thermal Joint: Soldering
 - 1.1.9 Thermal Joint: Brazing
 - 1.1.10 Thermal Joint: Ultrasonic welding
 - 1.1.11 Thermal Joint: Thermal Plastic Welding
 - 1.1.12 Chemical Joint: Solvent Welding
 - 1.1.13 Chemical Joint: Adhesives
 - 1.1.13.1 Basic Classification
 - 1.1.13.2 Function
 - Section Two The Basics of Joining
 - 2.1 Introduction
 - 2.1.1 Testing Requirements
 - 2.2 Factors for Joining Method
 - 2.2.1 Substrates
 - 2.2.1.1 METAL
 - 2.2.1.2 Plastic
 - 2.2.1.3 Rubber and Thermoplastic Elastomers
 - 2.2.1.4 Composites
 - 2.2.1.5 Glass
 - 2.2.1.6 Wood
 - 2.2.1.7 Overview of Substrate Properties
 - 2.2.1.8 Overview of Possible Substrate Combinations and Joining Methods
 - 2.2.1.9 Key Substrate Considerations
 - 2.2.2 Choice of Assembly Type
 - 2.2.3 Operating Conditions
 - 2.2.3.1 Environmental Factors
 - 2.2.3.2 Temperature Changes and Thermal Cycling
 - 2.2.3.3 External Environment and Humidity
 - 2.2.3.4 Chemical Resistance
 - 2.2.3.5 UV Resistance and Stability Under UV Light
 - 2.2.4 External Acting Forces
 - 2.2.4.1 Pressure
 - 2.2.4.2 Vibration
 - 2.2.4.3 Variable Loading
 - 2.2.4.4 Impact and Shock
 - 2.2.5 Design and Manufacturing Parameters
 - 2.2.5.1 Machining Accuracy
 - 2.2.5.2 Cosmetic Appearance
 - 2.2.5.3 Automation vs Manual Assembly
 - 2.2.5.4 Sealing of the Joint or Assembly
 - 2.2.5.5 Expected Life of the Assembly
 - Section Three The Evolution of Joining
 - 3.1 Evolution of Bonding
 - 3.1.1 incorporating new substances
 - 3.1.2 Weight Considerations and Strength Improvements
 - 3.1.3 Sustainability
 - 3.1.4 Noise, Vibration and Harshness (NVH)
 - 3.1.5 Prominent Industries and Applications
 - 3.1.6 Automotive Industry
 - 3.1.7 Aerospace Industry
 - 3.1.8 Recreational Vehicles
 - 3.1.9 Construction
 - 3.1.10 Paper
 - 3.1.11 Medical Applications
 - 3.1.12 Renewable Energy
 - 3.1.13 Electronics Industry
 - 3.1.14 Wearable Electronics
 - 3.1.15 Electric Motors
 - Section Four The Basics of Bonding
 - 4.1 Mechanical Interlocking Theory
 - 4.1.1 Electrostatic Adhesion Theory
 - 4.1.2 Diffusion Theory
 - 4.1.3 Wetting and Polarity
 - 4.2 Manufacturing and Assembly Process
 - 4.2.1 Operator Training
 - 4.2.2 Speed and Throughput
 - 4.2.3 Industrial Manufacturing Production
 - 4.2.4 Process Limitations
 - 4.2.5 Health and Safety
 - 4.3 Surface Preparation for Adhesive Bonding
 - 4.3.1 Cleaning
 - 4.3.1.1 Aqueous Cleaners
 - 4.3.1.2 Solvent-Based Cleaners
 - 4.3.2 Mechanical Cleaning
 - 4.3.2.1 Mechanical Cleaning by Hand
 - 4.3.2.2 Abrasion with Power Tools
 - 4.3.2.3 Abrasive Blasting
 - 4.3.2.4 Dry Ice Blasting
 - 4.3.3 Surface Preparation: Mechanical Abrasion and Roughening
 - 4.3.4 Surface Preparation: Chemical Preparation
 - 4.3.5 Surface Preparation: Chemical Activators
 - 4.3.6 Electrochemical Surface Treatments
 - 4.3.6.1 Plasma Treatment
 - 4.3.6.2 Corona Discharge
 - 4.3.6.3 Flame Treatment
 - 4.3.6.4 Thermal Surface Treatment
 - 4.4 Stresses on Joints
 - 4.4.1 Shear Stress
 - 4.4.2 Tensile Stress
 - 4.4.3 Compressive Stress
 - 4.4.4 Peel Stress
 - 4.4.5 Cleavage Stress
 - 4.4.6 Impact Stress
 - 4.4.7 Fatigue stress
 - 4.4.8 Thermal Expansion
 - 4.5 Environmental Factors
 - 4.5.1 Effect of the Environment
 - 4.5.2 Operating Temperature
 - 4.5.3 Humidity and Water
 - 4.5.4 Chemical Exposure
 - 4.5.5 UV Resistance
 - Section Five Application and Bond Process
 - 5.1 Adhesive Joint Design
 - 5.1.1 Assemblies and Joint Stress Distribution
 - 5.1.2 Types of Joints
 - 5.1.3 PLANAR SUBSTRATES
 - 5.1.3.1 Head-to-Head or Butt Joints
 - 5.1.3.2 Scarf Joint
 - 5.1.3.3 Double butt Joint or Half LAP
 - 5.1.3.4 Tongue and Groove Joint
 - 5.1.3.5 Strap Joint
 - 5.1.3.6 Single Strap Joint
 - 5.1.3.7 Double Strap Joint
 - 5.1.3.8 Recessed Double Strap Joint
 - 5.1.3.9 Bevelled Double Strap Joint
 - 5.1.3.10 Overlap Joint
 - 5.1.3.11 Joggle Lap Joint
 - 5.1.3.12 Overlap Joint, Tapered Edges (Bevelled Lap Joint)
 - 5.1.3.13 Double Lap Joint
 - 5.1.4 Non-Planar Substrates
 - 5.1.5 Cylindrical Substrates
 - 5.1.6 Joints with Plastic and Elastomeric Substrates
 - 5.1.7 Joints with Thin Substrates
 - 5.2 General Design Guidelines
 - 5.2.1 Summary of Suitability of Common Bonded Joint Types
 - 5.2.1.1 Gap Requirements for Bonded Assemblies
 - 5.2.1.2 Substrate Properties and Joint Performance
 - 5.2.1.3 Substrate Flexibility
 - 5.2.1.4 Substrate Thermal Expansion and Contraction
 - 5.2.1.5 Substrate Hardness
 - 5.2.1.6 Thickness
 - 5.2.1.7 Surface Energy
 - 5.2.1.8 Surface Roughness
 - 5.2.1.9 Surface Porosity
 - 5.2.1.10 Cleanliness
 - 5.2.1.11 Calculating Strength in Bonded Assemblies
 - 5.2.2 Factors for Bond line and Assembly Strength
 - 5.2.2.1 Technical data sheets (TDS) and Test Data
 - 5.2.3 Adhesive Chemical-Specific Properties
 - 5.2.4 Substrate Specification
 - 5.2.5 Customer-Specific Requirements and Testing
 - 5.3 Understanding Adhesive Volumes
 - 5.3.1 Calculating the Physical Volume of Cured Adhesive
 - 5.3.2 Calculating Adhesive Bead Size
 - 5.4 Application and Bond Process
 - 5.4.1 Dosification and Bonding Process
 - 5.4.2 Equipment Selection
 - 5.4.2.1 Manual Dispensing
 - 5.4.2.2 Semi-Automatic Dispensing
 - 5.4.2.3 Robotic Dispensing
 - 5.4.3 Fluid Characteristics of Adhesives
 - 5.4.4 Technology-Specific Characteristics
 - Section Six Adhesive Technologies
 - 6.1 Definition of an Adhesive
 - 6.1.1 Adhesive Terminology
 - 6.2 Instant Bonding
 - 6.2.1 Cyanoacrylates
 - 6.2.2 Two-Step, No-Mix Acrylics
 - 6.2.3 Light Cure Adhesives
 - 6.3 Flexible Bonding and Sealing
 - 6.3.1 Silane-Modified Polymers
 - 6.3.2 1c and 2C SMP Compositions
 - 6.3.3 Polyurethane (PU)
 - 6.3.4 Silicone
 - 6.3.5 1C Condensation Cure RTV Silicones
 - 6.3.6 2C Condensation Cure RTV Silicones
 - 6.3.7 2C Addition Cure RTV Silicones
 - 6.3.8 1C Heat Curing Silicones
 - 6.3.9 Light Cure Silicone
 - 6.3.10 Butyl Sealants
 - 6.4 Structural Bonding
 - 6.4.1 2C Methyl Methacrylate (MMA)
 - 6.4.2 Epoxy Adhesives
 - 6.4.3 Polyurethanes (PUs): 1C PU and 2C PU
 - 6.5 Hybrid Adhesives
 - 6.5.1 CA-Epoxy Hybrid General Applications
 - 6.5.2 CA-Acrylic Hybrid General Applications
 - 6.5.3 CA-Acrylic 10:1 General Applications
 - 6.6 Anaerobic Adhesives
 - 6.6.1 Threadlockers
 - 6.6.2 Anaerobic Gasketing Adhesives
 - 6.6.3 Anaerobic Thread Sealants
 - 6.6.4 Retaining Cylindrical Metal Assemblies
 - 6.7 Hotmelts
 - 6.7.1 Polyolefin (PO) & Ethyl Vinyl Acetate Hotmelts
 - 6.7.2 polyamide (PA) Hotmelts
 - 6.7.3 Polyurethane (PU) Reactive Hotmelts
 - 6.8 Solvent-based adhesives
 - 6.9 Water-Based Adhesive
 - 6.9.1 Water-Based Adhesive Chemistries
 - 6.9.1.1 Vinyl Acetate Monomer (VAM) - Based Emulsions (EVA or PVA Emulsions)
 - 6.9.1.2 Acrylic-Based Emulsions
 - 6.9.1.3 Natural-Based (or Bio-Based) Adhesives
 - 6.9.1.4 Natural Rubber (NR) Adhesives
 - 6.9.1.5 Liquid polyurethane (PU)
 - 6.9.2 Equipment Considerations
 - Section Seven Failure Model Analysis
 - 7.1 Troubleshooting: Failure Modes
 - 7.1.1 Adhesive Failure
 - 7.1.2 Cohesive Failure
 - 7.1.3 Substrate Failure
 - 7.1.4 Adhesive/Cohesive (Mixed) Failure
 - 7.2 A Practical Guide to Troubleshooting
 - 7.2.1 ’No ADHESIVE’
 - 7.2.2 ‘No Cure’
 - 7.2.3 ‘No adhesion’
 - 7.2.4 ‘No Performance’
 - 7.3 Critical Factors when Selecting Adhesives
 - 7.4 Containment and Complaint Detective Work
 - 7.5 The Eight Disciplines (8D)
 - 7.6 Failure Mode Analysis and Troubleshooting Help
 - Section Eight Appendix