5.1.7 Joints with Thin Substrates

5.1.7 Joints with Thin Substrates

In general, thin substrates are bonded using simple overlapping joints or slightly modified joints. The double strap configuration is one of the most effective for this application.

For thin materials, two important considerations should be noted:

1. The material used for reinforcement, or straps, must be made of the same or similar material with equivalent strength, flexibility and thickness as the assembly substrate.
2. The adhesive should have the same degree of flexibility as the substrates or greater flexibility than the substrates.

The thickness of the substrate is a very important variable for consideration. As the substrate thickness varies, so does the distribution of stresses within the joint and assembly; therefore, reinforcements to the joint may be required. As the thickness of the substrate decreases, the assembly will be more prone to peel forces. Conversely, as the thickness of the substrate increases, the assembly will be less prone to peeling forces.