LOCTITE®X Digital Manual for Bonding
- Bonding Overview
- Foreword
- Introduction
- Credits
- A special thank you to the editing team
- Additional Contributors
- Section One Introduction to Joining
- 1.1 Conventional Methods for Joining
- 1.1.1 Mechanical Joint: Threaded Fasteners
- 1.1.2 Mechanical Joint: Rivets
- 1.1.3 Mechanical Joint: Keyway
- 1.1.4 Mechanical Joint: Folding or Clinching
- 1.1.5 Mechanical Joint: Press Fit
- 1.1.6 Mechanical Joint: Shrink Fit
- 1.1.7 Thermal Joint: Welding
- 1.1.8 Thermal Joint: Soldering
- 1.1.9 Thermal Joint: Brazing
- 1.1.10 Thermal Joint: Ultrasonic welding
- 1.1.11 Thermal Joint: Thermal Plastic Welding
- 1.1.12 Chemical Joint: Solvent Welding
- 1.1.13 Chemical Joint: Adhesives
- 1.1.13.1 Basic Classification
- 1.1.13.2 Function
- Section Two The Basics of Joining
- 2.1 Introduction
- 2.1.1 Testing Requirements
- 2.2 Factors for Joining Method
- 2.2.1 Substrates
- 2.2.1.1 METAL
- 2.2.1.2 Plastic
- 2.2.1.3 Rubber and Thermoplastic Elastomers
- 2.2.1.4 Composites
- 2.2.1.5 Glass
- 2.2.1.6 Wood
- 2.2.1.7 Overview of Substrate Properties
- 2.2.1.8 Overview of Possible Substrate Combinations and Joining Methods
- 2.2.1.9 Key Substrate Considerations
- 2.2.2 Choice of Assembly Type
- 2.2.3 Operating Conditions
- 2.2.3.1 Environmental Factors
- 2.2.3.2 Temperature Changes and Thermal Cycling
- 2.2.3.3 External Environment and Humidity
- 2.2.3.4 Chemical Resistance
- 2.2.3.5 UV Resistance and Stability Under UV Light
- 2.2.4 External Acting Forces
- 2.2.4.1 Pressure
- 2.2.4.2 Vibration
- 2.2.4.3 Variable Loading
- 2.2.4.4 Impact and Shock
- 2.2.5 Design and Manufacturing Parameters
- 2.2.5.1 Machining Accuracy
- 2.2.5.2 Cosmetic Appearance
- 2.2.5.3 Automation vs Manual Assembly
- 2.2.5.4 Sealing of the Joint or Assembly
- 2.2.5.5 Expected Life of the Assembly
- Section Three The Evolution of Joining
- 3.1 Evolution of Bonding
- 3.1.1 incorporating new substances
- 3.1.2 Weight Considerations and Strength Improvements
- 3.1.3 Sustainability
- 3.1.4 Noise, Vibration and Harshness (NVH)
- 3.1.5 Prominent Industries and Applications
- 3.1.6 Automotive Industry
- 3.1.7 Aerospace Industry
- 3.1.8 Recreational Vehicles
- 3.1.9 Construction
- 3.1.10 Paper
- 3.1.11 Medical Applications
- 3.1.12 Renewable Energy
- 3.1.13 Electronics Industry
- 3.1.14 Wearable Electronics
- 3.1.15 Electric Motors
- Section Four The Basics of Bonding
- 4.1 Mechanical Interlocking Theory
- 4.1.1 Electrostatic Adhesion Theory
- 4.1.2 Diffusion Theory
- 4.1.3 Wetting and Polarity
- 4.2 Manufacturing and Assembly Process
- 4.2.1 Operator Training
- 4.2.2 Speed and Throughput
- 4.2.3 Industrial Manufacturing Production
- 4.2.4 Process Limitations
- 4.2.5 Health and Safety
- 4.3 Surface Preparation for Adhesive Bonding
- 4.3.1 Cleaning
- 4.3.1.1 Aqueous Cleaners
- 4.3.1.2 Solvent-Based Cleaners
- 4.3.2 Mechanical Cleaning
- 4.3.2.1 Mechanical Cleaning by Hand
- 4.3.2.2 Abrasion with Power Tools
- 4.3.2.3 Abrasive Blasting
- 4.3.2.4 Dry Ice Blasting
- 4.3.3 Surface Preparation: Mechanical Abrasion and Roughening
- 4.3.4 Surface Preparation: Chemical Preparation
- 4.3.5 Surface Preparation: Chemical Activators
- 4.3.6 Electrochemical Surface Treatments
- 4.3.6.1 Plasma Treatment
- 4.3.6.2 Corona Discharge
- 4.3.6.3 Flame Treatment
- 4.3.6.4 Thermal Surface Treatment
- 4.4 Stresses on Joints
- 4.4.1 Shear Stress
- 4.4.2 Tensile Stress
- 4.4.3 Compressive Stress
- 4.4.4 Peel Stress
- 4.4.5 Cleavage Stress
- 4.4.6 Impact Stress
- 4.4.7 Fatigue stress
- 4.4.8 Thermal Expansion
- 4.5 Environmental Factors
- 4.5.1 Effect of the Environment
- 4.5.2 Operating Temperature
- 4.5.3 Humidity and Water
- 4.5.4 Chemical Exposure
- 4.5.5 UV Resistance
- Section Five Application and Bond Process
- 5.1 Adhesive Joint Design
- 5.1.1 Assemblies and Joint Stress Distribution
- 5.1.2 Types of Joints
- 5.1.3 PLANAR SUBSTRATES
- 5.1.3.1 Head-to-Head or Butt Joints
- 5.1.3.2 Scarf Joint
- 5.1.3.3 Double butt Joint or Half LAP
- 5.1.3.4 Tongue and Groove Joint
- 5.1.3.5 Strap Joint
- 5.1.3.6 Single Strap Joint
- 5.1.3.7 Double Strap Joint
- 5.1.3.8 Recessed Double Strap Joint
- 5.1.3.9 Bevelled Double Strap Joint
- 5.1.3.10 Overlap Joint
- 5.1.3.11 Joggle Lap Joint
- 5.1.3.12 Overlap Joint, Tapered Edges (Bevelled Lap Joint)
- 5.1.3.13 Double Lap Joint
- 5.1.4 Non-Planar Substrates
- 5.1.5 Cylindrical Substrates
- 5.1.6 Joints with Plastic and Elastomeric Substrates
- 5.1.7 Joints with Thin Substrates
- 5.2 General Design Guidelines
- 5.2.1 Summary of Suitability of Common Bonded Joint Types
- 5.2.1.1 Gap Requirements for Bonded Assemblies
- 5.2.1.2 Substrate Properties and Joint Performance
- 5.2.1.3 Substrate Flexibility
- 5.2.1.4 Substrate Thermal Expansion and Contraction
- 5.2.1.5 Substrate Hardness
- 5.2.1.6 Thickness
- 5.2.1.7 Surface Energy
- 5.2.1.8 Surface Roughness
- 5.2.1.9 Surface Porosity
- 5.2.1.10 Cleanliness
- 5.2.1.11 Calculating Strength in Bonded Assemblies
- 5.2.2 Factors for Bond line and Assembly Strength
- 5.2.2.1 Technical data sheets (TDS) and Test Data
- 5.2.3 Adhesive Chemical-Specific Properties
- 5.2.4 Substrate Specification
- 5.2.5 Customer-Specific Requirements and Testing
- 5.3 Understanding Adhesive Volumes
- 5.3.1 Calculating the Physical Volume of Cured Adhesive
- 5.3.2 Calculating Adhesive Bead Size
- 5.4 Application and Bond Process
- 5.4.1 Dosification and Bonding Process
- 5.4.2 Equipment Selection
- 5.4.2.1 Manual Dispensing
- 5.4.2.2 Semi-Automatic Dispensing
- 5.4.2.3 Robotic Dispensing
- 5.4.3 Fluid Characteristics of Adhesives
- 5.4.4 Technology-Specific Characteristics
- Section Six Adhesive Technologies
- 6.1 Definition of an Adhesive
- 6.1.1 Adhesive Terminology
- 6.2 Instant Bonding
- 6.2.1 Cyanoacrylates
- 6.2.2 Two-Step, No-Mix Acrylics
- 6.2.3 Light Cure Adhesives
- 6.3 Flexible Bonding and Sealing
- 6.3.1 Silane-Modified Polymers
- 6.3.2 1c and 2C SMP Compositions
- 6.3.3 Polyurethane (PU)
- 6.3.4 Silicone
- 6.3.5 1C Condensation Cure RTV Silicones
- 6.3.6 2C Condensation Cure RTV Silicones
- 6.3.7 2C Addition Cure RTV Silicones
- 6.3.8 1C Heat Curing Silicones
- 6.3.9 Light Cure Silicone
- 6.3.10 Butyl Sealants
- 6.4 Structural Bonding
- 6.4.1 2C Methyl Methacrylate (MMA)
- 6.4.2 Epoxy Adhesives
- 6.4.3 Polyurethanes (PUs): 1C PU and 2C PU
- 6.5 Hybrid Adhesives
- 6.5.1 CA-Epoxy Hybrid General Applications
- 6.5.2 CA-Acrylic Hybrid General Applications
- 6.5.3 CA-Acrylic 10:1 General Applications
- 6.6 Anaerobic Adhesives
- 6.6.1 Threadlockers
- 6.6.2 Anaerobic Gasketing Adhesives
- 6.6.3 Anaerobic Thread Sealants
- 6.6.4 Retaining Cylindrical Metal Assemblies
- 6.7 Hotmelts
- 6.7.1 Polyolefin (PO) & Ethyl Vinyl Acetate Hotmelts
- 6.7.2 polyamide (PA) Hotmelts
- 6.7.3 Polyurethane (PU) Reactive Hotmelts
- 6.8 Solvent-based adhesives
- 6.9 Water-Based Adhesive
- 6.9.1 Water-Based Adhesive Chemistries
- 6.9.1.1 Vinyl Acetate Monomer (VAM) - Based Emulsions (EVA or PVA Emulsions)
- 6.9.1.2 Acrylic-Based Emulsions
- 6.9.1.3 Natural-Based (or Bio-Based) Adhesives
- 6.9.1.4 Natural Rubber (NR) Adhesives
- 6.9.1.5 Liquid polyurethane (PU)
- 6.9.2 Equipment Considerations
- Section Seven Failure Model Analysis
- 7.1 Troubleshooting: Failure Modes
- 7.1.1 Adhesive Failure
- 7.1.2 Cohesive Failure
- 7.1.3 Substrate Failure
- 7.1.4 Adhesive/Cohesive (Mixed) Failure
- 7.2 A Practical Guide to Troubleshooting
- 7.2.1 ’No ADHESIVE’
- 7.2.2 ‘No Cure’
- 7.2.3 ‘No adhesion’
- 7.2.4 ‘No Performance’
- 7.3 Critical Factors when Selecting Adhesives
- 7.4 Containment and Complaint Detective Work
- 7.5 The Eight Disciplines (8D)
- 7.6 Failure Mode Analysis and Troubleshooting Help
- Section Eight Appendix